Title :
An overview of device modeling in bridging manufacturing and design for RF applications
Author_Institution :
Sky works Solutions Inc., Irvine, CA, USA
Abstract :
CMOS has become a viable option for RF applications and system-on-chip. This paper reviews device modeling in predicting device behavior for RF IC applications. CMOS downsealing is discussed to examine the trend of device scaling and its impact to high frequency performance of devices. Some device behavior in advanced technology nodes is analyzed to be included in advanced device models. RF models to predict DC, AC noise and distortion behavior are desired while additional modeling efforts are required for parasitics such as interconnect and substrate.
Keywords :
CMOS integrated circuits; radiofrequency integrated circuits; semiconductor device models; CMOS downsealing; RF applications; device behavior prediction; device modeling; device scaling; system-on-chip; Application specific integrated circuits; CMOS technology; Integrated circuit modeling; Integrated circuit noise; Predictive models; Radio frequency; Radiofrequency integrated circuits; Semiconductor device modeling; System-on-a-chip; Virtual manufacturing;
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
DOI :
10.1109/ICSICT.2004.1436712
