DocumentCode :
43596
Title :
1/f Noise and Defects in Microelectronic Materials and Devices
Author :
Fleetwood, D.M.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Vanderbilt Univ., Nashville, TN, USA
Volume :
62
Issue :
4
fYear :
2015
fDate :
Aug. 2015
Firstpage :
1462
Lastpage :
1486
Abstract :
This paper reviews and compares predictions of the Dutta-Horn model of low-frequency excess (1/ f) noise with experimental results for thin metal films, MOS transistors, and GaN/AlGaN high-electron mobility transistors (HEMTs). For metal films, mobility fluctuations associated with carrier-defect scattering lead to 1/f noise. In contrast, for most semiconductor devices, the noise usually results from fluctuations in the number of carriers due to charge exchange between the channel and defects, usually at or near a critical semiconductor/insulator interface. The Dutta-Horn model describes the noise with high precision in most cases. Insight into the physical mechanisms that lead to noise in microelectronic materials and devices has been obtained via total-ionizing-dose irradiation and/or thermal annealing, as illustrated with several examples. With the assistance of the Dutta-Horn model, measurements of the noise magnitude and temperature and/or voltage dependence of the noise enable estimates of the energy distributions of defects that lead to 1/f noise. The microstructure of several defects and/or impurities that cause noise in MOS devices (primarily O vacancies) and GaN/AlGaN HEMTs (e.g., hydrogenated impurity centers, N vacancies, and/or Fe centers) have been identified via experiments and density functional theory calculations.
Keywords :
1/f noise; III-V semiconductors; MOSFET; aluminium compounds; density functional theory; gallium compounds; high electron mobility transistors; metallic thin films; radiation hardening (electronics); semiconductor device models; semiconductor device noise; Dutta-Horn model; GaN-AlGaN; GaN-AlGaN HEMT; GaN-AlGaN high-electron mobility transistors; MOS devices; MOS transistors; carrier-defect scattering; charge exchange; critical semiconductor-insulator interface; density functional theory calculations; energy distributions; low-frequency excess noise; microelectronic materials; microstructure; mobility fluctuations; noise magnitude; semiconductor devices; thermal annealing; thin metal films; total-ionizing-dose irradiation; voltage dependence; Frequency measurement; Metals; Noise; Noise measurement; Scattering; Temperature measurement; Thermal noise; Border traps; HEMTs; MOS devices; gallium nitride; interface traps; low-frequency noise; noise; oxide traps; radiation response; silicon carbide;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/TNS.2015.2405852
Filename :
7094326
Link To Document :
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