DocumentCode :
435973
Title :
Non-contact inter-chip data communications technology for system in a package
Author :
Kitroda, T.
Author_Institution :
Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan
Volume :
2
fYear :
2004
fDate :
18-21 Oct. 2004
Firstpage :
1347
Abstract :
A wireless bus for stacked chips in a package is presented. It uses inductive coupling of metal inductors on the chips. This paper discusses inductive interchip signaling, transceiver circuit design, modeling of magnetic field and electric circuits, theory for inductor layout optimization, cross talk analysis in its array arrangement, and cross talk countermeasures. A transceiver is designed and fabricated in 0.35μm CMOS and measured. The maximum data rate is 1.2 Gb/s/channel with 45 mW from 3.3 V in 300 μm distance. Cross talk is measured by an embedded voltage detector on the chip. Good agreements are found between the measurements and the theoretical calculations. It is found that cross talk is minimized by arranging channels at intervals of a certain distance. A technique based on time division multiple access is also proposed to further reduce the cross talk.
Keywords :
crosstalk; data communication; integrated circuit design; system buses; system-on-chip; transceivers; 0.35 micron; 3.3 V; 45 mW; CMOS integrated circuit; cross talk analysis; cross talk countermeasures; electric circuits; embedded voltage detector; inductive coupling; inductive interchip signaling; inductor layout optimization; magnetic field; metal inductors; noncontact interchip data communications technology; stacked chips in a package; system in a package; time division multiple access; transceiver circuit design; wireless bus; Circuit synthesis; Communications technology; Coupling circuits; Data communication; Inductors; Magnetic field measurement; Packaging; Semiconductor device measurement; Semiconductor device modeling; Transceivers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated Circuits Technology, 2004. Proceedings. 7th International Conference on
Print_ISBN :
0-7803-8511-X
Type :
conf
DOI :
10.1109/ICSICT.2004.1436802
Filename :
1436802
Link To Document :
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