DocumentCode :
436804
Title :
Cleaning of residual silicon on InP regrowth interface in MOVPE reactor
Author :
Naniwae, Koichi ; Ohya, Masaki ; Hamamoto, Kiichi ; Nishi, Kenichi ; Sasaki, Tatsuya
Author_Institution :
Syst. Devices Res. Labs, NEC Corp., Shiga, Japan
fYear :
2004
fDate :
31 May-4 June 2004
Firstpage :
126
Lastpage :
129
Abstract :
Investigating the use of tertiarybutylchloride (TBCl) to clean residual silicon from InP regrowth interfaces in an MOVPE reactor, we found the amount of the residual silicon to be greatly decreased when trimethylindium was supplied together with TBCl in order to balance the etching rate and the growth rate during the cleaning process. Using this cleaning process in the fabrication of buried hetero-structure laser diodes, we demonstrated that it improves their light-current characteristics by reducing the leakage current in the devices.
Keywords :
III-V semiconductors; MOCVD; etching; impurities; indium compounds; leakage currents; optical fabrication; semiconductor lasers; surface cleaning; vapour phase epitaxial growth; InP:Si; MOVPE reactor; buried heterostructure laser diodes; etching rate; leakage current; light-current characteristics; regrowth interface; residual silicon cleaning; tertiarybutylchloride; trimethylindium; Cleaning; Diode lasers; Epitaxial growth; Epitaxial layers; Etching; Indium phosphide; Inductors; Leakage current; Optical device fabrication; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials, 2004. 16th IPRM. 2004 International Conference on
ISSN :
1092-8669
Print_ISBN :
0-7803-8595-0
Type :
conf
DOI :
10.1109/ICIPRM.2004.1442627
Filename :
1442627
Link To Document :
بازگشت