DocumentCode
437116
Title
Thermal performance of water-cooled heat sinks
Author
Salem, T.E. ; Bayne, S.B. ; Porschet, D. ; Chen, Y.
Author_Institution
Dept. of Electr. Eng., US Naval Acad., Annapolis, MD
Volume
1
fYear
2005
fDate
6-10 March 2005
Firstpage
129
Abstract
As power electronic applications continue to switch higher levels of voltage and current in smaller-sized component packages, the resulting increase in power density requires efficient thermal management. This paper compares the thermal performance for operating a MOSFET on a water-cooled pole-arrayed heat sink versus a novel water-cooled microchannel heat sink
Keywords
MOSFET; heat sinks; power electronics; thermal management (packaging); MOSFET; power density; power electronic; thermal management; water-cooled microchannel heat sink; water-cooled pole-arrayed heat sink; Electronic packaging thermal management; Energy management; Heat sinks; MOSFET circuits; Power electronics; Switches; Thermal management; Thermal management of electronics; Voltage; Water heating;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition, 2005. APEC 2005. Twentieth Annual IEEE
Conference_Location
Austin, TX
Print_ISBN
0-7803-8975-1
Type
conf
DOI
10.1109/APEC.2005.1452902
Filename
1452902
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