• DocumentCode
    437226
  • Title

    A die-scale micromachining process for bulk PZT and its application to in-plane actuators

  • Author

    Li, Tao ; Gianchandani, Yogesh B.

  • Author_Institution
    Eng. Res. Center for Wireless Integrated Syst., Michigan Univ., Ann Arbor, MI, USA
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    387
  • Lastpage
    390
  • Abstract
    Bulk ceramics (including PZT) are important materials for electronic and microsystem packaging or device applications, but they are usually difficult to pattern lithographically. A fabrication process combining lithography, electroplating, batch mode micro electro-discharge machining (μEDM) and batch mode micro ultrasonic machining (μUSM), LEEDUS, has been developed to provide die-scale pattern transfer capability from lithographic masks onto ceramics, glass or other brittle materials. A related process (SEDUS) uses serial μEDM and omits lithography. Feature sizes of 25 μm have been micromachined on the glass-mica (Macor™) ceramic plate with a 4.5×4.5 mm2 die size, 34 μm cutting depth, and 18 μm/min machining rate. As a demonstration an octagonal spiral shaped in-plane actuator was fabricated from bulk PZT using this process. A device of 20 μm thickness and 450 μm × 420 μm footprint produces a displacement of ∼2 μm at 40 V.
  • Keywords
    electroplating; glass; mica; microactuators; micromachining; photolithography; piezoceramics; ultrasonic machining; μUSM; 20 micron; 25 micron; 34 micron; 40 V; LEEDUS; Macor ceramic plate; SEDUS; batch mode micro electro-discharge machining; batch mode micro ultrasonic machining; bulk PZT; bulk ceramics; die-scale micromachining process; die-scale pattern transfer capability; electroplating; glass-mica ceramic plate; in-plane actuators; lithographic masks; lithography; octagonal spiral shaped in-plane actuator; serial μEDM; Actuators; Ceramics; Electronics packaging; Fabrication; Glass; Lithography; Machining; Micromachining; Packaging machines; Spirals;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1453948
  • Filename
    1453948