• DocumentCode
    437243
  • Title

    Size-dependent bubble dynamics in a microchannel heat sink

  • Author

    Cheung, Luthur Siu Lun ; Lee, Man ; Lee, Yi-Kuen ; Wong, Man ; Zohar, Yitshak

  • Author_Institution
    Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
  • fYear
    2005
  • fDate
    30 Jan.-3 Feb. 2005
  • Firstpage
    670
  • Lastpage
    673
  • Abstract
    The height effect on bubble dynamics in a microchannel is experimentally studied. We reported that the critical size for a nucleation site to be active increases linearly with the channel height. However, once a bubble is formed, its evolution from incipience to departure can also be channel-size dependent. Thus, various microchannel heat sinks have been fabricated, about 5-10 μm in height, with integrated temperature sensors utilizing Si-to-glass anodic bonding technology. Nucleation sites have been formed on the microchannels bottom silicon surface in order to ensure regular bubble formation, while the sensors allow continuous monitoring of the wall temperature. The microchannels are capped by a glass wafer; hence, it is possible to record the bubble activity using video equipment. The three aspects of bubble dynamics: growth rate, departure size and release frequency have been characterized experimentally, and proper control parameters have been identified.
  • Keywords
    bubbles; heat sinks; microfluidics; nanotechnology; nucleation; semiconductor-insulator-semiconductor devices; temperature sensors; anodic bonding technology; bubble activity; bubble dynamics; bubble formation; channel height; departure size; glass wafer; growth rate; height effect; microchannel heat sink; nucleation site; release frequency; silicon surface; temperature sensors; wall temperature; Frequency; Glass; Heat sinks; Microchannel; Monitoring; Sensor phenomena and characterization; Silicon; Temperature sensors; Video equipment; Wafer bonding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-8732-5
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2005.1454018
  • Filename
    1454018