DocumentCode
437243
Title
Size-dependent bubble dynamics in a microchannel heat sink
Author
Cheung, Luthur Siu Lun ; Lee, Man ; Lee, Yi-Kuen ; Wong, Man ; Zohar, Yitshak
Author_Institution
Dept. of Aerosp. & Mech. Eng., Arizona Univ., Tucson, AZ, USA
fYear
2005
fDate
30 Jan.-3 Feb. 2005
Firstpage
670
Lastpage
673
Abstract
The height effect on bubble dynamics in a microchannel is experimentally studied. We reported that the critical size for a nucleation site to be active increases linearly with the channel height. However, once a bubble is formed, its evolution from incipience to departure can also be channel-size dependent. Thus, various microchannel heat sinks have been fabricated, about 5-10 μm in height, with integrated temperature sensors utilizing Si-to-glass anodic bonding technology. Nucleation sites have been formed on the microchannels bottom silicon surface in order to ensure regular bubble formation, while the sensors allow continuous monitoring of the wall temperature. The microchannels are capped by a glass wafer; hence, it is possible to record the bubble activity using video equipment. The three aspects of bubble dynamics: growth rate, departure size and release frequency have been characterized experimentally, and proper control parameters have been identified.
Keywords
bubbles; heat sinks; microfluidics; nanotechnology; nucleation; semiconductor-insulator-semiconductor devices; temperature sensors; anodic bonding technology; bubble activity; bubble dynamics; bubble formation; channel height; departure size; glass wafer; growth rate; height effect; microchannel heat sink; nucleation site; release frequency; silicon surface; temperature sensors; wall temperature; Frequency; Glass; Heat sinks; Microchannel; Monitoring; Sensor phenomena and characterization; Silicon; Temperature sensors; Video equipment; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
ISSN
1084-6999
Print_ISBN
0-7803-8732-5
Type
conf
DOI
10.1109/MEMSYS.2005.1454018
Filename
1454018
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