Title :
A fully-dry PECVD-oxynitride process for microGC column fabrication
Author :
Agah, M. ; Wise, Y.D.
Author_Institution :
Eng. Res. Center for Wireless Integrated MicroSystems, Michigan Univ., Ann Arbor, MI, USA
fDate :
30 Jan.-3 Feb. 2005
Abstract :
This paper reports the development of a fully-dry process for fabricating ultra-low-mass separation columns for a micro gas chromatograph (μGC). This new CMOS-compatible buried-channel technique utilizes stress-free PECVD oxynitride films having a deposition rate of about 1 μm/min and an etch rate less than 200Å/min in SF6 plasma to form 25cm-long 65μm-ID semicircular columns on a 6mm square chip. In vacuum, such columns can achieve 100°C at less than 10mW with a thermal time constant under 1 min.
Keywords :
CVD coatings; chromatography; micromechanical devices; plasma CVD; silicon compounds; μGC; 25 cm; 6 mm; 65 micron; CMOS-compatible buried-channel technique; SF6; SF6 plasma; deposition rate; dry PECVD oxynitride process; etch rate; micro gas chromatograph; microGC column fabrication; semicircular column; stress-free PECVD oxynitride films; ultra-low-mass separation column fabrication; Delay; Energy consumption; Etching; Gases; Monitoring; Plasma applications; Semiconductor films; Silicon; Sulfur hexafluoride; Wafer bonding;
Conference_Titel :
Micro Electro Mechanical Systems, 2005. MEMS 2005. 18th IEEE International Conference on
Print_ISBN :
0-7803-8732-5
DOI :
10.1109/MEMSYS.2005.1454044
