• DocumentCode
    43737
  • Title

    Au-Free Normally-Off AlGaN/GaN-on-Si MIS-HEMTs Using Combined Partially Recessed and Fluorinated Trap-Charge Gate Structures

  • Author

    Huolin Huang ; Liang, Yung C. ; Samudra, Ganesh S. ; Ngo, Cassandra Low Lee

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore, Singapore
  • Volume
    35
  • Issue
    5
  • fYear
    2014
  • fDate
    May-14
  • Firstpage
    569
  • Lastpage
    571
  • Abstract
    In this letter, partially recessed gate structures in conjunction with negative trap charges by F- plasma treatments both at AlGaN barrier and on gate dielectric surface are employed to realize the normally-OFF operation for AlGaN/GaN Metal-Insulator-Semiconductor High Electron Mobility Transistors in Au-free scheme. A partial gate recessed trench is designed to effectively reduce the 2-D electron gas (2DEG) density and achieve positive threshold voltage (Vth) without severe degradation in 2-DEG channel mobility. Furthermore, the fixed trap charges are innovatively placed at the gate AlGaN and Si3N4 layers by a two-stage F- plasma treatment to further increase the Vth, without mobility degradation. A high Vth of 1.9 V and a drain current ~200 mA/mm are achieved in the fabricated device, which also has a lower leakage current and the higher breakdown voltage of 580 V.
  • Keywords
    III-V semiconductors; MIS devices; aluminium compounds; electron mobility; gallium compounds; high electron mobility transistors; leakage currents; semiconductor device breakdown; sputter etching; two-dimensional electron gas; wide band gap semiconductors; 2D electron gas density; 2DEG channel mobility; AlGaN-GaN-Si; Au-free scheme; F- plasma treatments; MIS-HEMTs; Si; breakdown voltage; drain current; fixed trap charges; fluorinated trap-charge gate structures; leakage current; metal-insulator-semiconductor high electron mobility transistors; negative trap charges; normally-OFF operation; partial gate recessed trench; partially recessed gate structures; positive threshold voltage; voltage 1.9 V; voltage 580 V; Aluminum gallium nitride; Dielectrics; Gallium nitride; HEMTs; Logic gates; MODFETs; Plasmas; AlGaN/GaN HEMTs; Au-free; gate trench; normally-off; plasma treatment; plasma treatment.;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2014.2310851
  • Filename
    6776414