DocumentCode :
438411
Title :
Substrate resistance extraction with direct boundary element method
Author :
Wang, Xiren ; Yu, Wenjian ; Wang, Zeyi
Author_Institution :
Dept. Comput. Sci. & Technol., Tsinghua Univ., Beijing, China
Volume :
1
fYear :
2005
fDate :
18-21 Jan. 2005
Firstpage :
208
Abstract :
It is important to model the substrate coupling for mixed-signal circuit designs today. This paper presents the direct boundary element method (BEM) for substrate resistance calculation, where only the boundary of substrate region is discretized. Firstly, an efficient scheme for non-uniform element partition is proposed. Secondly, a new technique is presented which can reduce the scale of produced linear system and then accelerate the equation solving, especially for the multiple right-hand sides problem like substrate resistance extraction. Experiments show that the proposed method has shown high efficiency compared with existing methods while preserving high accuracy.
Keywords :
boundary-elements methods; integrated circuit design; mixed analogue-digital integrated circuits; substrates; direct boundary element method; mixed signal circuit designs; nonuniform element partition; substrate coupling; substrate resistance extraction; Boundary element methods; Contact resistance; Electric potential; Geometry; Green´s function methods; Integral equations; Laplace equations; Linear systems; Matrices; Surface resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Design Automation Conference, 2005. Proceedings of the ASP-DAC 2005. Asia and South Pacific
Print_ISBN :
0-7803-8736-8
Type :
conf
DOI :
10.1109/ASPDAC.2005.1466159
Filename :
1466159
Link To Document :
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