• DocumentCode
    4389
  • Title

    InP DHBT Amplifier Modules Operating Between 150–300 GHz Using Membrane Technology

  • Author

    Eriksson, K. ; Sobis, P.J. ; Gunnarsson, S.E. ; Hanning, J. ; Zirath, H.

  • Author_Institution
    Dept. of Microtechnol. & Nanosci., Chalmers Univ. of Technol., Goteborg, Sweden
  • Volume
    63
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    433
  • Lastpage
    440
  • Abstract
    In this paper, we present WR05 (140-220 GHz) and WR03 (220-325 GHz) five-stage amplifier modules with novel membrane microstrip-to-waveguide transitions. The modules use a 250-nm InP double heterojunction bipolar transistor (DHBT) technology and multilayer thin-film microstrip transmission lines. The waveguide transitions use E-plane probes on 3- μm-thin GaAs membrane substrate. Beam lead connectors integrated on the transition eliminate the need of highly reactive bond wires. In addition, process steps such as backside metallization, backside vias, and nonrectangular dicing of the integrated circuits (ICs) are not required. The WR05 amplifier module demonstrates a peak gain of 24 dB at 245 GHz and more than 10-dB gain from 155 to 270 GHz. The WR-03 module has 19-dB gain from 230 to 254 GHz with input and output return loss better than 10 dB from 225 to 330 GHz. The two modules were also characterized in terms of noise. The minimum noise figures were measured to 9.7 dB at 195 GHz and 10.8 dB at 240 GHz for the WR05 and WR03 modules, respectively. To the authors´ best knowledge, these are the first published results on an InP DHBT amplifier modules operating at these high frequencies. It is also the first time that membrane technology is used for IC packaging, regardless of IC technology.
  • Keywords
    gallium arsenide; heterojunction bipolar transistors; indium compounds; integrated circuit packaging; millimetre wave amplifiers; millimetre wave integrated circuits; thin film devices; transmission lines; DHBT amplifier modules; GaAs; IC packaging; IC technology; InP; WR-03 module; WR05 amplifier module; beam lead connectors; double heterojunction bipolar transistor technology; e-plane probes; five-stage amplifier modules; frequency 140 GHz to 220 GHz; frequency 220 GHz to 325 GHz; gain 19 dB; gain 24 dB; integrated circuits; membrane microstrip-to-waveguide transitions; multilayer thin-film microstrip transmission lines; reactive bond wires; size 250 nm; thin membrane substrate; DH-HEMTs; Gain; Indium phosphide; Loss measurement; Probes; Substrates; Waveguide transitions; Amplifier; WR03; WR05; double heterojunction bipolar transistor (DHBT); indium phosphide (InP); membrane; multilayer; waveguide packaging; waveguide transition;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2014.2384493
  • Filename
    7001672