DocumentCode :
439060
Title :
Hybrid spectral/neural model based integrated control and supervision of a distributed thermal process in IC packaging
Author :
Deng, Hua ; Li, Han-Xiong
Author_Institution :
Dept. of Manuf. Eng. & Eng. Manage., City Univ. of Hong Kong, China
fYear :
2005
fDate :
June 8-10, 2005
Firstpage :
256
Lastpage :
261
Keywords :
adhesives; centralised control; curing; electronics industry; integrated circuit packaging; microassembling; neurocontrollers; optimal control; optimisation; process control; reliability; spectral analysis; thermal management (packaging); IC packaging; adhesive die attach; cure schedule optimization; decoupling control; die attachment; distributed thermal process; electronics industry; hybrid spectral-neural model; integrated control; optimal curing; process supervision; reliability; Centralized control; Curing; Integrated circuit modeling; Integrated circuit packaging; Job shop scheduling; Optimal scheduling; Ovens; Temperature control; Temperature sensors; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
American Control Conference, 2005. Proceedings of the 2005
ISSN :
0743-1619
Print_ISBN :
0-7803-9098-9
Electronic_ISBN :
0743-1619
Type :
conf
DOI :
10.1109/ACC.2005.1469942
Filename :
1469942
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=439060
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