Title :
Reducing Switching Losses in BLDC Motor Drives by Reducing Body Diode Conduction of MOSFETs
Author :
Brown, Cameron D. ; Sarlioglu, Bulent
Author_Institution :
Adv. Missiles & Unmanned Syst., Boeing Defense, Space & Security, Boeing Co., St. Charles, MO, USA
Abstract :
This paper presents a new power electronic topology that aims to reduce switching losses in hard-switched inverters for brushless dc (BLDC) motor drives. This is achieved by extending the benefits of synchronous rectification used in low-voltage switch-mode dc-dc conversion to high-voltage motor drive applications and by minimizing the reverse conduction behavior of the intrinsic body diode of the synchronous rectifier MOSFET. The proposed topology for reducing body diode conduction includes the addition of a MOSFET in series with the rectifying switch and a SiC Schottky diode around the series switch combination. This paper focuses on theory, simulations, and experimental results and validates the benefits of proposed new topology for BLDC motor drive applications. An extension of this topology for sinusoidal back electromotive force permanent-magnet motors is also presented.
Keywords :
DC motor drives; DC-DC power convertors; MOSFET; Schottky diodes; brushless DC motors; invertors; permanent magnet motors; switching convertors; BLDC motor drives; Schottky diode; body diode conduction reduction; brushless dc motor drives; hard-switched inverters; high-voltage motor drive; low-voltage switch-mode dc-dc conversion; rectifying switch; reverse conduction behavior; sinusoidal back electromotive force permanent-magnet motors; switching losses reduction; synchronous rectification; synchronous rectifier MOSFET; Bridge circuits; Brushless DC motors; Delays; Logic gates; MOSFET; Schottky diodes; Switches; Brushless motors; MOSFET circuits; Schottky diodes; motor drives; p-i-n diodes; permanent-magnet machines; permanent-magnet motors; power MOSFET; power semiconductor devices; switching loss;
Journal_Title :
Industry Applications, IEEE Transactions on
DOI :
10.1109/TIA.2014.2344506