Title :
Wire self-heating in supply lines on bulk-CMOS ICs
Author_Institution :
Philips Research Laboratories, Eindhoven, The Netherlands
Abstract :
In contradiction with existing literature [1-4], the temperature rise caused by wire self-heating in bulk-CMOS technologies with aluminium back-end as well as with copper and low-k dielectrics is shown to be negligible. When common design practices are applied, the elecromigration and voltage drop requirements limit this temperature rise to only a few degrees.
Keywords :
CMOS technology; Copper; Current density; Electromigration; Heating; Integrated circuit interconnections; Power dissipation; Temperature; Voltage; Wire;
Conference_Titel :
Solid-State Circuits Conference, 2002. ESSCIRC 2002. Proceedings of the 28th European
Conference_Location :
Florence, Italy
