DocumentCode :
439777
Title :
A packaged 2.4 GHz LNA in a 0.15 µm CMOS process with 2kV HBM ESD protection
Author :
Chandrasekhar, V. ; Hung, C.M. ; Ho, Y. ; Mayaram, K.
Author_Institution :
Oregon State University, Corvallis, OR, USA
fYear :
2002
fDate :
24-26 Sept. 2002
Firstpage :
347
Lastpage :
350
Abstract :
This paper presents the first 2.4 GHz LNA with 2kV HBM ESD protection integrated in a 0.15 µm CMOS process. The LNA has been packaged in a standard TQFP48 package and achieves the best overall performance reported to date in a CMOS process at low power. The LNA has a NF of 2.77 dB, an S21of 12.1 dB and an IIP3 of +2.4 dBm at a current consumption of 3 mA from a 1.5V supply. A comparison of this LNA with another LNA having a similar schematic and pinout but without ESD protection demonstrates performance degradation due to the ESD structures at high frequencies. The LNA without ESD protection has a NF of 2.36 dB, an S21of 14 dB and an IIP3 of -2.2 dBm at the same bias condition.
Keywords :
Bonding; CMOS process; CMOS technology; Costs; Electrostatic discharge; Impedance matching; Noise measurement; Packaging; Protection; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference, 2002. ESSCIRC 2002. Proceedings of the 28th European
Conference_Location :
Florence, Italy
Type :
conf
Filename :
1471536
Link To Document :
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