DocumentCode :
440208
Title :
Advanced Flip Chip Technologies
Author :
Oppermann, H. Hermann ; Aschenbrenner, Rolf ; Reichl, Herbert
Author_Institution :
FhG IZM, Germany
Volume :
1
fYear :
1999
fDate :
13-15 Sept. 1999
Firstpage :
64
Lastpage :
71
Keywords :
Bonding; Costs; Electronic packaging thermal management; Electronics packaging; Flip chip; Frequency; Inorganic materials; Joining materials; Power system reliability; Surface-mount technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 1999. Proceeding of the 29th European
Conference_Location :
Leuven, Belgium
Print_ISBN :
2-86332-245-1
Type :
conf
Filename :
1505450
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=440208
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