Title :
Time Dependency of the Planarization Process in Copper Chemical-Mechanical Polishing
Author :
Nguyen, V.H. ; Timmer, B. ; van Kranenburg, H. ; Woerlee, P.H.
Author_Institution :
University of Twente, Enschede, The Netherlands
Keywords :
Chemical processes; Chemistry; Copper; Integrated circuit interconnections; Planarization; Rough surfaces; Slurries; Surface morphology; Surface roughness; Testing;
Conference_Titel :
Solid-State Device Research Conference, 1999. Proceeding of the 29th European
Conference_Location :
Leuven, Belgium
Print_ISBN :
2-86332-245-1
