Title :
Mechanical lapping, handling and transfer of ultra-thin wafers
Author :
Pinel, S. ; Tasselli, J. ; Bailbé, J.P. ; Marty, A. ; Puech, P. ; Estève, D.
Author_Institution :
Lab. d´´Analyse et d´´Architecture des Systemes du C.N.R.S., Toulouse, France
Keywords :
Abrasives; Fabrication; Grain size; Integrated circuit interconnections; Lapping; Powders; Semiconductor materials; Silicon; Substrates; Wet etching;
Conference_Titel :
Solid-State Device Research Conference, 1999. Proceeding of the 29th European
Conference_Location :
Leuven, Belgium
Print_ISBN :
2-86332-245-1
