DocumentCode :
440242
Title :
Evaluation of Room Temperature Wafer Bonding by Fabrication of a GaAs/Pt/Si Metal Base Transistor
Author :
Dessein, K. ; Németh, S. ; Vlutters, R. ; Delaey, L. ; De Boeck, J. ; Borghs, G.
Author_Institution :
IMEC, Leuven, Belgium
Volume :
1
fYear :
1999
fDate :
13-15 Sept. 1999
Firstpage :
280
Lastpage :
283
Keywords :
Electrons; Fabrication; Gallium arsenide; Magnetic devices; Magnetic multilayers; Schottky barriers; Sputtering; Substrates; Temperature sensors; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Device Research Conference, 1999. Proceeding of the 29th European
Conference_Location :
Leuven, Belgium
Print_ISBN :
2-86332-245-1
Type :
conf
Filename :
1505494
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=440242