Title :
Novel Surface-Micromachined Thermal Actuator for Fracture and Reliability Characterisation of Polysilicon by Electrical Wafer-Level Testing
Author :
Kapels, H. ; Urscher, J. ; Aigner, R. ; Sattler, R. ; Wachutka, G. ; Binder, J.
Author_Institution :
Infineon Technologies, Munich, Germany
Keywords :
Electric variables measurement; Electrical resistance measurement; Electrostatic actuators; Electrothermal effects; Micromechanical devices; Microstructure; Stability; Surface cracks; Testing; Thermal stresses;
Conference_Titel :
Solid-State Device Research Conference, 1999. Proceeding of the 29th European
Conference_Location :
Leuven, Belgium
Print_ISBN :
2-86332-245-1
