Title :
A Hybrid De-Embedding Technique of Eye Diagram Measurement for High-Speed Digital Interconnections
Author :
Chi-Fang Huang ; Yen-Lin Chao
Author_Institution :
Grad. Inst. of Commun. Eng., Tatung Univ., Taipei, Taiwan
Abstract :
By a modeling technique of equivalent lumped circuit for high-speed interconnections, an innovative method is proposed to predict the physical intrinsic eye diagram. Such a technique is based on the measured impedance profile results of time-domain reflectometry, which includes the electric characteristics both of the connector itself and testing jigs. The latter´s are to be removed to leave the connector´s part only for the eye diagram prediction. This method can be verified further by SPICE simulation and measurement in this paper.
Keywords :
electric connectors; electric impedance measurement; embedded systems; equivalent circuits; interconnections; time-domain reflectometry; SPICE simulation; connector; equivalent lumped circuit technique; high-speed digital interconnection; hybrid deembedding technique; impedance profile measurement; physical intrinsic eye diagram measurement; testing jig; time-domain reflectometry; Connectors; Equivalent circuits; Fixtures; Impedance; Integrated circuit interconnections; Integrated circuit modeling; Transmission line measurements; Equivalent lumped circuit; SPICE model; eye diagram; high-speed interconnections; time-domain reflectometry (TDR); time-domain reflectometry (TDR).;
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2014.2309799
