Title :
17 GHz receiver in TSLP package for WLAN/ISM applications in 0.13 μm CMOS
Author :
Kienmayer, Christoph ; Engl, Mario ; Desch, Andreas ; Thüringer, Ronald ; Berry, Mohit ; Tiebout, Marc ; Scholtz, Arpad L. ; Weigel, R.
Author_Institution :
Infineon Technol. AG, Munich, Germany
Abstract :
This work presents a fully integrated CMOS receiver in a leadless plastic package (TSLP) for high data rate WLAN applications at 17.2 GHz ISM band. The receiver offers a gain of 35 dB, input 1dB compression point of -49.6 dBm, SSB noise figure of 9.9 dB and an input IP3 of -39.8 dBm. At a power supply of 1.5 V, the receiver, which includes LNA, complex demodulator, VCO, IQ-divider and all RF-buffers, consumes only 245 mW.
Keywords :
CMOS integrated circuits; electronics packaging; microwave integrated circuits; microwave receivers; plastic packaging; wireless LAN; 0.13 micron; 1.5 V; 17.2 GHz; 245 mW; 35 dB; 9.9 dB; CMOS receivers; IQ-divider; ISM applications; LNA circuits; TLSP package; VCO circuits; WLAN applications; all RF buffers; demodulator circuits; leadless plastic package; Assembly; Contacts; Copper; Flip chip; Frequency; Lead; Nickel; Packaging; Testing; Wireless LAN;
Conference_Titel :
Solid-State Circuits Conference, 2005. ESSCIRC 2005. Proceedings of the 31st European
Print_ISBN :
0-7803-9205-1
DOI :
10.1109/ESSCIR.2005.1541577
