DocumentCode
444636
Title
Transfer functions of on-chip global interconnects based on distributed RLCG interconnects model
Author
Kang, Kai ; Yin, Wen-Yan ; Li, Lei-Wei
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
Volume
1A
fYear
2005
fDate
3-8 July 2005
Firstpage
524
Abstract
Novel transfer functions for on-chip global interconnects are rigorously derived based on distributed resistance, inductance, capacitance and conductance (RLCG) transmission line model with typical boundary conditions. The new interconnect transfer function reveals that the distributed conductance of interconnects has a severe effect on interconnect performance. The peak value of voltage decreases about 50% in the case of g=0.33 S/m, compared with the ideal lossless case of g=0 for the finite length interconnect with an open circuit termination and an arbitrary source impedance. The crosstalk between coupled interconnects is also examined and demonstrated numerically.
Keywords
crosstalk; digital integrated circuits; distributed parameter networks; electric potential; integrated circuit interconnections; transfer functions; 0.33 S/m; arbitrary source impedance; boundary conditions; coupled interconnects; crosstalk; distributed conductance; distributed resistance-inductance-capacitance-conductance transmission line model; finite length interconnect; high-speed digital circuits; on-chip global interconnect transfer functions; open circuit termination; Boundary conditions; Capacitance; Coupling circuits; Crosstalk; Impedance; Inductance; Integrated circuit interconnections; Transfer functions; Transmission lines; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2005 IEEE
Print_ISBN
0-7803-8883-6
Type
conf
DOI
10.1109/APS.2005.1551370
Filename
1551370
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