• DocumentCode
    444636
  • Title

    Transfer functions of on-chip global interconnects based on distributed RLCG interconnects model

  • Author

    Kang, Kai ; Yin, Wen-Yan ; Li, Lei-Wei

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • Volume
    1A
  • fYear
    2005
  • fDate
    3-8 July 2005
  • Firstpage
    524
  • Abstract
    Novel transfer functions for on-chip global interconnects are rigorously derived based on distributed resistance, inductance, capacitance and conductance (RLCG) transmission line model with typical boundary conditions. The new interconnect transfer function reveals that the distributed conductance of interconnects has a severe effect on interconnect performance. The peak value of voltage decreases about 50% in the case of g=0.33 S/m, compared with the ideal lossless case of g=0 for the finite length interconnect with an open circuit termination and an arbitrary source impedance. The crosstalk between coupled interconnects is also examined and demonstrated numerically.
  • Keywords
    crosstalk; digital integrated circuits; distributed parameter networks; electric potential; integrated circuit interconnections; transfer functions; 0.33 S/m; arbitrary source impedance; boundary conditions; coupled interconnects; crosstalk; distributed conductance; distributed resistance-inductance-capacitance-conductance transmission line model; finite length interconnect; high-speed digital circuits; on-chip global interconnect transfer functions; open circuit termination; Boundary conditions; Capacitance; Coupling circuits; Crosstalk; Impedance; Inductance; Integrated circuit interconnections; Transfer functions; Transmission lines; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2005 IEEE
  • Print_ISBN
    0-7803-8883-6
  • Type

    conf

  • DOI
    10.1109/APS.2005.1551370
  • Filename
    1551370