• DocumentCode
    444940
  • Title

    Radiative characteristic of on-chip terahertz (THz) structures

  • Author

    Hussein, Yasser A. ; Spencer, James E.

  • Author_Institution
    Stanford Linear Accelerator Center, Stanford Univ., Menlo Park, CA, USA
  • Volume
    2B
  • fYear
    2005
  • fDate
    3-8 July 2005
  • Firstpage
    250
  • Abstract
    There are possibilities for producing narrow-band THz radiation, using either free or bound electrons (solid state), in micro-undulatory configurations because integrated circuit technology appears well matched to this region, which extends from about 300 GHz to 30 THz. We present electromagnetic simulations for various new on-chip THz configurations. Interference effects are studied in terms of both structural shape and tuning parameters to improve output intensity, bandwidth and directionality. Results imply that we can design an efficient THz radiator by tuning the phases of the EM-waves propagating from the different sections of the structure. Results are validated by comparing two independent calculations from the developed FDTD code and a commercial finite-element code (HFSS); they agree quite well. We concentrate mainly on the radiative characteristics and determine whether the underlying electromagnetic assumptions are sound.
  • Keywords
    computational electromagnetics; finite difference time-domain analysis; finite element analysis; submillimetre wave antennas; submillimetre wave integrated circuits; FDTD code; bound electrons; electromagnetic simulations; finite-element code; free electrons; integrated circuit technology; interference effects; micro-undulatory configurations; on-chip terahertz structures; Bandwidth; Circuit optimization; Circuit simulation; Electromagnetic radiation; Electromagnetic radiative interference; Electrons; Integrated circuit technology; Narrowband; Solid state circuits; Structural shapes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2005 IEEE
  • Print_ISBN
    0-7803-8883-6
  • Type

    conf

  • DOI
    10.1109/APS.2005.1551987
  • Filename
    1551987