DocumentCode :
445375
Title :
Effects of TiN overlay on ALD TaCN metal gate/high-k MOSFET characteristics
Author :
Zhang, Z.B. ; Song, S.C. ; Choi, K. ; Sim, J.H. ; Majhi, P. ; Lee, B.H.
Volume :
1
fYear :
2005
fDate :
22-22 June 2005
Firstpage :
223
Lastpage :
224
Abstract :
This paper describes a simple process that can tune the work function of ALD TaCN on HfO2 from 4.47eV to 4.77eV by adding a MOCVD TiN overlayer. It also discusses the device characteristics of TaCN and TiN/TaCN (TaCN with a TiN overlayer) metal gate/high-k MOSFETs and presents a manufacturable process for integrating the dual metal gate/high-k CMOS in FD-FET technology
Keywords :
MOCVD; MOSFET; atomic layer deposition; carbon compounds; dielectric thin films; hafnium compounds; tantalum compounds; titanium compounds; work function; 4.47 to 4.77 eV; ALD; FD-FET technology; HfO2; MOCVD; MOSFET; TiN-TaCN; manufacturable process; metal gate; work function; CMOS process; CMOS technology; Electrodes; Hafnium oxide; High K dielectric materials; High-K gate dielectrics; MOCVD; MOS devices; MOSFET circuits; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Device Research Conference Digest, 2005. DRC '05. 63rd
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-9040-7
Type :
conf
DOI :
10.1109/DRC.2005.1553130
Filename :
1553130
Link To Document :
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