DocumentCode :
4488
Title :
A 1.55 \\mu m 40 Gbps EML TOSA Employing a Novel FPC Connection
Author :
Shirao, M. ; Ohata, N. ; Yasui, Nobuyuki ; Uto, Kuniaki ; Fukao, T. ; Hatta, T. ; Aruga, H. ; Mizuochi, Takashi
Author_Institution :
Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Kamakura, Japan
Volume :
32
Issue :
19
fYear :
2014
fDate :
Oct.1, 1 2014
Firstpage :
3344
Lastpage :
3350
Abstract :
We have developed a 1.55-μm 40 Gbps electro-absorption modulator laser (EML)-based transmitter optical subassembly (TOSA) using a novel flexible printed circuit (FPC). The return loss at the junctions of the printed circuit board and the FPC, and of the FPC and the ceramic feedthrough connection was held better than 20 dB at up to 40 GHz by a newly developed three-layer FPC. The TOSA was fabricated and demonstrated a mask margin of >16% and a path penalty of <;0.63 dB for a 43 Gbps signal after 2.4-km SMF transmission over the entire case temperature range from -5° to 80 °C, demonstrating compliance with ITU-T G.693. These results are comparable to coaxial connector type EML modules. This TOSA is expected to be a strong candidate for 40 Gbps EML modules with excellent operating characteristics, economy, and a small footprint.
Keywords :
electro-optical modulation; optical fibre communication; optical fibre couplers; optical fibre fabrication; optical fibre losses; optical interconnections; optical transmitters; printed circuits; EML TOSA fabrication; EML-based transmitter optical subassembly; SMF transmission; bit rate 40 Gbit/s; ceramic feedthrough connection; distance 2.4 km; electro-absorption modulator laser; flexible printed circuit board; frequency 40 GHz; gain 20 dB; optical return loss; temperature -5 degC to 80 degC; three-layer FPC connection; wavelength 1.55 mum; Ceramics; High-speed optical techniques; Optical device fabrication; Optical distortion; Optical reflection; Optical transmitters; Electro-absorption modulator laser; XLMD2-MSA; flexible printed circuit; high speed transmitter; transmitter optical sub-assembly;
fLanguage :
English
Journal_Title :
Lightwave Technology, Journal of
Publisher :
ieee
ISSN :
0733-8724
Type :
jour
DOI :
10.1109/JLT.2014.2344111
Filename :
6868254
Link To Document :
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