DocumentCode :
45084
Title :
Characteristic Resistance of No-Insulation and Partial-Insulation Coils With Nonuniform Current Distribution
Author :
Dong Gyu Yang ; Seungyong Hahn ; Youngjae Kim ; Kwang Lok Kim ; Jung-Bin Song ; Bascunan, Juan ; Haigun Lee ; Iwasa, Yukikazu
Author_Institution :
Francis Bitter Magn. Lab. (FBML), Massachusetts Inst. of Technol. (MIT), Cambridge, MA, USA
Volume :
24
Issue :
3
fYear :
2014
fDate :
Jun-14
Firstpage :
1
Lastpage :
5
Abstract :
This paper proposes a numerical approach to calculate the characteristic resistance (Rc) of partial-insulation (PI) and no-insulation (NI) high-temperature superconductor pancake coils with the nonuniform current path in such coils taken into consideration. Recently, an analytic approach has been proposed to estimate (Rc) of an NI coil, where the coil current is assumed to be “uniform” over the entire coil. This model, however, is not effective to explain the increase of (Rc) when a coil is modified from NI to PI. In this paper, we first introduce our numerical approach based on a finite element analysis. Then, the charging characteristics of selected PI and NI coils that we had previously reported are analyzed by the proposed approach. Reasonable agreement between the measured and calculated data validates the proposed approach to estimate (Rc) of a PI as well as an NI coil.
Keywords :
finite element analysis; superconducting coils; characteristic resistance; coil current; finite element analysis; high temperature superconductor pancake coils; nonuniform current distribution; nonuniform current path; partial insulation coils; Coils; Current distribution; Finite element analysis; High-temperature superconductors; Insulation; Nickel; Resistance; Characteristic resistance; finite element method (FEM); no-insulation (NI); nonuniform current; partial-insulation (PI);
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/TASC.2013.2285103
Filename :
6626558
Link To Document :
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