• DocumentCode
    452246
  • Title

    Active Inter Poser (AIP) for chip level optical interconnections

  • Author

    Hiramatsu, Seiki ; Kinoshita, Masao ; Hiruma, Kenji ; Ishizuka, Takeshi ; Okabe, Masahiro ; Furuyama, Hideto ; Mikawa, Takashi ; Ibaragi, Osamu

  • Author_Institution
    Dept. of Integration Technol. Res., Association of Super-Adv. Electron. Technol., Tokyo
  • Volume
    2
  • fYear
    2002
  • fDate
    8-12 Sept. 2002
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    We have developed active inter poser (AIP) as the E/O interface component in the surface mount technology (SMT). Developed AIP mounted MSM-PD by flip chip bonding can receive 1.25 Gbit/s optical signals through a polymeric waveguide array
  • Keywords
    flip-chip devices; integrated optics; integrated optoelectronics; metal-semiconductor-metal structures; optical arrays; optical fibre communication; optical interconnections; optical polymers; optical receivers; optical transmitters; optical waveguides; photodiodes; surface mount technology; 1.25 Gbit/s; E/O interface component; active inter poser; chip level interconnections; flip chip bonding; metal-semiconductor-metal photodiode; optical interconnections; optical signals; polymeric waveguide array; receiver active inter poser; surface mount technology; transmitter active inter poser;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Communication, 2002. ECOC 2002. 28th European Conference on
  • Conference_Location
    Copenhagen
  • Print_ISBN
    87-90974-63-8
  • Type

    conf

  • Filename
    1601036
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=452246