DocumentCode :
452618
Title :
Baw components for PCS-CDMA applications
Author :
Schmidhammer, E. ; Heinze, H. ; Woelky, M. ; Schmiedgen, M. ; Henn, G. ; Braun, R. ; Metzger, T.
Volume :
1
fYear :
2005
fDate :
18-21 Sept. 2005
Firstpage :
89
Lastpage :
92
Keywords :
Acoustic waves; Chip scale packaging; Filters; Manufacturing; Mobile handsets; Multiaccess communication; Personal communication networks; Robust stability; Surface acoustic waves; Temperature measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2005 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-9382-1
Type :
conf
DOI :
10.1109/ULTSYM.2005.1602803
Filename :
1602803
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=452618
