DocumentCode :
452688
Title :
Through-wafer trench-isolated electrical interconnects for CMUT arrays
Author :
Zhuang, Xuefeng ; Ergun, Arif S. ; Oralkan, Ömer ; Huang, Yongli ; Wygant, Ira O. ; Yaralioglu, Goksen G. ; Yeh, David T. ; Khuri-Yakub, Butrus T.
Volume :
1
fYear :
2005
fDate :
18-21 Sept. 2005
Firstpage :
475
Lastpage :
478
Keywords :
Biomembranes; Electric resistance; Etching; Fabrication; Rough surfaces; Silicon; Substrates; Surface roughness; Ultrasonic transducer arrays; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2005 IEEE
ISSN :
1051-0117
Print_ISBN :
0-7803-9382-1
Type :
conf
DOI :
10.1109/ULTSYM.2005.1602894
Filename :
1602894
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=452688
