Title :
Finite-ground thin-film microstrip interconnects (TFMIs) and their power handling capabilities over ultra-wide frequency ranges
Author :
Yin, Wen-Yan ; Dong, X.T. ; Mao, Junfa
Author_Institution :
Sch. of Electron. Inf. & Electr. Eng., Shanghai Jiao Tong Univ., China
Abstract :
Various finite-ground thin-film microstrip interconnects (TFMIs) used in the design of high-speed circuit, monolithic microwave and millimeter-wave integrated circuits are studied and compared. Based on the distributed parameters extracted and the thermal model proposed to calculate the rise in temperature, the average power handling capabilities (APHCs) of finite-ground TFMIs on benzocyclobutene (BCB), polyimide and LTCC films over ultra-wide frequency ranges are investigated. Numerical results are given to show the enhancement in APHCs achieved by choosing appropriate metallization conductivity and thickness, BCB thermal conductivity, and polyimide thickness etc.
Keywords :
ceramics; dielectric thin films; integrated circuit interconnections; microstrip lines; LTCC films; benzocyclobutene films; finite-ground thin-film microstrip interconnects; high-speed circuit; millimeter-wave integrated circuits; monolithic microwave circuits; polyimide films; power handling capabilities; thermal model; Frequency; Integrated circuit interconnections; Metallization; Microstrip; Millimeter wave integrated circuits; Polyimides; Temperature distribution; Thermal conductivity; Thin film circuits; Transistors;
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
DOI :
10.1109/APMC.2005.1606428
