DocumentCode
453105
Title
Time-domain vector fitting extracted characteristic model for VLSI interconnects analysis
Author
Ip, S.K.
Author_Institution
Dept. of Electron. & Inf. Eng.,, Hong Kong Polytech. Univ., Kowloon, China
Volume
2
fYear
2005
fDate
4-7 Dec. 2005
Abstract
In this paper, a systematic method for deriving the characteristic model of interconnects from time-domain vector fitting is presented. The method is based on the iteration and convolution of time series by recursion. The approach extracts model parameters from terminal voltage waveforms directly by time-domain vector fitting so that transformation to frequency domain can be avoided and interconnect terminated with active nonlinear loading can be simulated efficiently in SPICE-compatible simulator. Example is given to illustrate the accuracy of the extracted model.
Keywords
SPICE; VLSI; integrated circuit interconnections; integrated circuit modelling; time-domain analysis; SPICE; VLSI interconnects analysis; frequency domain; terminal voltage waveforms; time-domain vector fitting; Circuit simulation; Data mining; Equivalent circuits; Finite difference methods; Integrated circuit interconnections; Matrix converters; SPICE; Time domain analysis; Very large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN
0-7803-9433-X
Type
conf
DOI
10.1109/APMC.2005.1606429
Filename
1606429
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