Capacitance extraction of high-density 3D interconnects using finite element method

Author

Xu, Jianfeng ; Yin, Wen-Yan ; Mao, Junfa

Author_Institution

Sch. of Electron. & Electr. Eng., Shanghai Jiao Tong Univ., China

Volume

2

fYear

2005

fDate

4-7 Dec. 2005

Abstract

In this paper, the element-by-element technique in conjunction with preconditioned conjugate gradient (PCG) solver is adopted for fast parameter extraction of multi-layer and multi-conductor interconnects in VLSI circuit. In order to partially implement parallel computation, the proposed technique takes advantage of Fortran 95 in the array manipulation, and the efficiency of this technique is verified by numerical examples. Compared to some reference solutions, both the memory requirement and the CPU time are significantly reduced while maintaining a relatively high accuracy.

Keywords

VLSI; conjugate gradient methods; finite element analysis; integrated circuit interconnections; Fortran 95; VLSI circuit; capacitance extraction; finite element method; high-density 3D interconnects; multiconductor interconnects; multilayer interconnects; preconditioned conjugate gradient; Boundary conditions; Capacitance; Concurrent computing; Dielectrics; Finite element methods; Frequency; Integral equations; Integrated circuit interconnections; Parameter extraction; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606435

Filename

1606435