DocumentCode :
453109
Title :
Capacitance extraction of high-density 3D interconnects using finite element method
Author :
Xu, Jianfeng ; Yin, Wen-Yan ; Mao, Junfa
Author_Institution :
Sch. of Electron. & Electr. Eng., Shanghai Jiao Tong Univ., China
Volume :
2
fYear :
2005
fDate :
4-7 Dec. 2005
Abstract :
In this paper, the element-by-element technique in conjunction with preconditioned conjugate gradient (PCG) solver is adopted for fast parameter extraction of multi-layer and multi-conductor interconnects in VLSI circuit. In order to partially implement parallel computation, the proposed technique takes advantage of Fortran 95 in the array manipulation, and the efficiency of this technique is verified by numerical examples. Compared to some reference solutions, both the memory requirement and the CPU time are significantly reduced while maintaining a relatively high accuracy.
Keywords :
VLSI; conjugate gradient methods; finite element analysis; integrated circuit interconnections; Fortran 95; VLSI circuit; capacitance extraction; finite element method; high-density 3D interconnects; multiconductor interconnects; multilayer interconnects; preconditioned conjugate gradient; Boundary conditions; Capacitance; Concurrent computing; Dielectrics; Finite element methods; Frequency; Integral equations; Integrated circuit interconnections; Parameter extraction; Very large scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
Print_ISBN :
0-7803-9433-X
Type :
conf
DOI :
10.1109/APMC.2005.1606435
Filename :
1606435
Link To Document :
بازگشت