Title :
Size reduction of MMIC packages using compression approach simulations
Author :
Lesage, Jean-Marc ; Loison, Renaud ; Gillard, Raphaël ; Barbier, Thierry ; Mancuso, Yves
Author_Institution :
Thales Airborne Syst., Elancourt, France
Abstract :
In this paper, global EM simulations of packaged MMIC modules are performed using the compression approach. First, this approach is validated thanks to comparisons with measurements. The cover height influence is studied in order to reduce package dimensions. Finally, the choice of the MMIC location inside the package allows the reduction of package cover height without significant performance degradations.
Keywords :
MMIC; circuit simulation; integrated circuit packaging; EM simulations; MMIC modules; MMIC packages; compression approach simulations; package size reduction; Bonding; Broadband amplifiers; Capacitors; Electronics packaging; Gallium arsenide; MMICs; Microwave technology; Radio frequency; Radiofrequency amplifiers; Topology;
Conference_Titel :
Microwave Conference, 2005 European
Print_ISBN :
2-9600551-2-8
DOI :
10.1109/EUMC.2005.1608902
