Antenna-on-package concept: shielding of backside radiation and study of electromagnetic near field inside package

Author

Mestdagh, S. ; Vandenbosch, G.A.E.

Author_Institution

Dept. ESAT-Telemic, Katholieke Universiteit Leuven, Heverlee, Belgium

Volume

3

fYear

2005

fDate

4-6 Oct. 2005

Abstract

In recent years a lot of research has been performed in the field of antenna integration. Very interesting is the integration of a planar radiating element in the package surrounding a chip. The electromagnetic field at the back of the antenna is not negligible, and may cause interference with the circuits in the chip, possibly encumbering the operation of the system. This interference was quantified by a numerical near field analysis, and shielding methods to reduce it were investigated.

Keywords

antenna radiation patterns; electromagnetic shielding; interference; antenna integration; antenna-on-package concept; backside radiation shielding; electromagnetic field; electromagnetic near field inside package; interference; numerical near field analysis; planar radiating element; Circuits; Dielectrics; Electromagnetic analysis; Electromagnetic fields; Electromagnetic radiation; Electromagnetic radiative interference; Electromagnetic shielding; Electronics packaging; Microstrip antennas; Near-field radiation pattern;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference, 2005 European

Print_ISBN

2-9600551-2-8

Type

conf

DOI

10.1109/EUMC.2005.1610286

Filename

1610286