DocumentCode
453614
Title
Design for manufacturing with increasing variability
Author
Lin, Xi-Wei
Author_Institution
Silicon Eng. Group, Synopsys Inc., Mountain View, CA
Volume
1
fYear
2005
fDate
24-0 Oct. 2005
Firstpage
1175
Lastpage
1179
Abstract
After a brief review of the current DFM solutions, this presentation focuses on three areas: a) TCAD based modeling that brings process parameters into spice models, enabling direct communication between manufacturing and design. b) Stress proximity effects which cause design variability and require better modeling. c) The complexity of interconnect variations in timing analysis
Keywords
design for manufacture; integrated circuit design; integrated circuit interconnections; technology CAD (electronics); DFM; TCAD based modeling; design for manufacturing; design variability; interconnect variations complexity; process parameters; spice models; stress proximity effects; timing analysis; Design for manufacture; Integrated circuit interconnections; Manufacturing processes; Process design; Proximity effect; Semiconductor device manufacture; Silicon; Stress; Timing; Virtual manufacturing;
fLanguage
English
Publisher
ieee
Conference_Titel
ASIC, 2005. ASICON 2005. 6th International Conference On
Conference_Location
Shanghai
Print_ISBN
0-7803-9210-8
Type
conf
DOI
10.1109/ICASIC.2005.1611244
Filename
1611244
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