• DocumentCode
    454455
  • Title

    Extraction of Defect Density and Size Distributions from Wafer Sort Test Results

  • Author

    Nelson, J.E. ; Zanon, T. ; Desineni, R. ; Brown, J.G. ; Patil, N. ; Maly, W. ; Blanton, R.D.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA
  • Volume
    1
  • fYear
    2006
  • fDate
    6-10 March 2006
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Defect density and defect size distributions (DDSDs) are key parameters used in IC yield loss predictions. Traditionally, memories and specialized test structures have been used to estimate these distributions. In this paper, we propose a strategy to accurately estimate DDSDs for shorts in metal layers using production IC test results
  • Keywords
    design for manufacture; integrated circuit testing; integrated circuit yield; DDSD estimation; defect density; defect size distributions; integrated circuit yield; metal layers; production IC test results; wafer sort test results; Circuit testing; Computational modeling; Integrated circuit manufacture; Integrated circuit testing; Integrated circuit yield; Production; Semiconductor device modeling; Silicon; System testing; Yield estimation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Automation and Test in Europe, 2006. DATE '06. Proceedings
  • Conference_Location
    Munich
  • Print_ISBN
    3-9810801-1-4
  • Type

    conf

  • DOI
    10.1109/DATE.2006.243807
  • Filename
    1657020
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=454455