• DocumentCode
    45515
  • Title

    Simulation of Low-Pressure Capacitively Coupled Plasmas Combining a Parallelized Particle-in-Cell Simulation and Direct Simulation of Monte Carlo

  • Author

    Jin Seok Kim ; Min Young Hur ; In Cheol Song ; Ho-Jun Lee ; Hae June Lee

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Pusan Nat. Univ., Busan, South Korea
  • Volume
    42
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    3819
  • Lastpage
    3824
  • Abstract
    A parallelized particle-in-cell (PIC) simulation and direct simulation of Monte Carlo (DSMC) are combined to simulate low-pressure discharges. A two-dimensional (2-D) PIC simulation parallelized with graphics processing units is used to examine the discharge characteristics of a capacitively coupled plasma device at pressures <; 10 mTorr, whereas a DSMC method is used to calculate the neutral distribution instead of a fluid model. The neutral distribution profile is transferred to the PIC simulation as the initial condition. At low gas pressures, the neutral density profile shows nonuniform properties, which also changes the simulation results of plasma uniformity. Overall, the inclusion of an accurate neutral density profile is essential for obtaining exact simulation results that are comparable with the experimental results.
  • Keywords
    Monte Carlo methods; high-frequency discharges; plasma simulation; Monte Carlo simulation; capacitively coupled plasma device; direct simulation; discharge characteristics; gas pressures; graphics processing units; low-pressure capacitively coupled plasmas; neutral density profile; neutral distribution profile; parallelized particle-in-cell simulation; plasma uniformity; two-dimensional PIC simulation; Computational modeling; Discharges (electric); Mathematical model; Monte Carlo methods; Plasma temperature; Semiconductor process modeling; Capacitively coupled plasmas (CCPs); direct simulation of Monte Carlo (DSMC); particle-in-cell (PIC); particle-in-cell (PIC).;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2014.2368145
  • Filename
    6960097