DocumentCode :
45549
Title :
Report on ICSD 2013
Volume :
30
Issue :
1
fYear :
2014
fDate :
January-February 2014
Firstpage :
49
Lastpage :
50
Abstract :
The 11th IEEE International Conference on Solid Dielectrics (ICSD) was held in Bologna, June 30 to July 4, 2013. A total of 245 registrants, and 27 accompanying persons, attended the conference. Of the registrants, 66% were from academia, and the remainder from industry and research centers. Of the registrants, 33% (83) were students.
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2014.6701108
Filename :
6701108
Link To Document :
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