• DocumentCode
    45549
  • Title

    Report on ICSD 2013

  • Volume
    30
  • Issue
    1
  • fYear
    2014
  • fDate
    January-February 2014
  • Firstpage
    49
  • Lastpage
    50
  • Abstract
    The 11th IEEE International Conference on Solid Dielectrics (ICSD) was held in Bologna, June 30 to July 4, 2013. A total of 245 registrants, and 27 accompanying persons, attended the conference. Of the registrants, 66% were from academia, and the remainder from industry and research centers. Of the registrants, 33% (83) were students.
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2014.6701108
  • Filename
    6701108
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=45549