Title :
Keynote Address: Developments in Cost Effective Packaging Technology for Microsystems Devices
Author_Institution :
Technol. For Ind. Ltd., St. Ives
Abstract :
The article consists of a Powerpoint presentation on packaging technology for microsystems devices. The areas discussed include: microsystems packaging; wafer level packaging; systems in a package; inertial sensors; side airbag sensor; fluidic sensors; microfluidic devices; fibre optic devices; subsystem integration; wafer bonding; flip chip assembly; angular rate sensor; and optical microsystems etc. etc.
Keywords :
flip-chip devices; micro-optomechanical devices; microfluidics; microsensors; optical fibres; system-in-package; wafer bonding; wafer level packaging; angular rate sensor; cost effective packaging technology; fibre optic devices; flip chip assembly; fluidic sensors; inertial sensors; microfluidic devices; microsystems devices; microsystems packaging; optical microsystems; side airbag sensor; subsystem integration; systems-in-package; wafer bonding; wafer level packaging;
Conference_Titel :
MEMS Sensors and Actuators, 2006. The Institution of Engineering and Technology Seminar on
Conference_Location :
London
Print_ISBN :
0-86341-627-6
