• DocumentCode
    45658
  • Title

    New Wideband Transition From Microstrip Line to Substrate Integrated Waveguide

  • Author

    Kordiboroujeni, Zamzam ; Bornemann, Jens

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Victoria, Victoria, BC, Canada
  • Volume
    62
  • Issue
    12
  • fYear
    2014
  • fDate
    Dec. 2014
  • Firstpage
    2983
  • Lastpage
    2989
  • Abstract
    A new wideband transition from microstrip line to substrate integrated waveguide (SIW) is introduced. Unlike most transitions that show reduced return loss over significant parts of a regular waveguide band, the presented configuration achieves return losses better than 30 dB in standard waveguide frequency bands from X to E. The new aspect of this transition is the addition of two vias to the widely used microstrip taper transition. Moreover, the influence of the substrate height is demonstrated. The results in each frequency band are compared with the data for the regular microstrip taper alone. A design formula for the placement of the vias and taper dimensions is presented and demonstrated to provide excellent results. The structures are simulated and optimized with CST Microwave Studio. Measurements performed on a Ku-band back-to-back prototype transition demonstrate a minimum return loss of 26.05 dB and maximum insertion loss of 0.821 dB over the entire Ku-band, thus validating the design approach.
  • Keywords
    microstrip transitions; substrate integrated waveguides; CST Microwave Studio; Ku-band back-to-back prototype transition; SIW; loss 0.821 dB; loss 26.05 dB; microstrip line; microstrip taper transition; return loss; substrate integrated waveguide; wideband transition; Cutoff frequency; Impedance; Microstrip; Substrates; Waveguide transitions; Wideband; Microstrip; substrate integrated waveguide (SIW); taper; transition; wideband;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2014.2365794
  • Filename
    6960115