DocumentCode :
457548
Title :
Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation
Author :
Kim, Jaemin ; Jeong, Youchul ; Kim, Jingook ; Lee, Junho ; Shim, Jongjoo ; Kim, Joungho
Author_Institution :
KAIST
Volume :
1
fYear :
2006
fDate :
14-18 Aug. 2006
Firstpage :
16
Lastpage :
19
Keywords :
Electronic mail; Frequency domain analysis; Impedance; Integrated circuit packaging; Laboratories; Power supplies; Power system interconnection; Power system modeling; Power system reliability; Resonance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
Type :
conf
DOI :
10.1109/ISEMC.2006.1706254
Filename :
1706254
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=457548
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