Title :
Using via fences for crosstalk reduction in PCB circuits
Author :
Suntives, Asanee ; Khajooeizadeh, Arash ; Abhari, Ramesh
Author_Institution :
McGill University
Keywords :
Crosstalk; Electronic circuits; Electronics packaging; Frequency; Integrated circuit interconnections; Microstrip; Parametric study; Resonance; Routing; Scattering parameters;
Conference_Titel :
Electromagnetic Compatibility, 2006. EMC 2006. 2006 IEEE International Symposium on
Conference_Location :
Portland, OR, USA
Print_ISBN :
1-4244-0293-X
DOI :
10.1109/ISEMC.2006.1706258
