Title :
An Improved Four-Port Equivalent Circuit Model of RF MOSFETs for Breakdown Operation
Author :
Chie-In Lee ; Yan-Ting Lin ; Wei-Cheng Lin
Author_Institution :
Dept. of Electr. Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
In this paper, an improved four-port radio-frequency (RF) model for metal-oxide-semiconductor field-effect transistors is extended to investigate the various RF breakdown phenomena where reliability is a concern for the first time. Reduction of isolation from drain to source as well as inductive behavior occurred at the drain, and source terminals in the breakdown region are analyzed and explained by using this modified four-port RF model incorporating with an inductive breakdown network. In addition, reduction of inductive source impedance in the breakdown regime is analyzed based on a series feedback mechanism and degradation of transconductance. Parameters of the modified four-port breakdown model are extracted by fitting measured four-port measurement data in the breakdown regime. Good agreement between measured and simulated 16 four-port scattering parameters (S-parameters) is achieved in the breakdown and saturation regions, validating the improved four-port breakdown model. Therefore, this model can be beneficial to RF amplifier designs in the breakdown regime with reliability considered.
Keywords :
MOSFET; S-parameters; circuit feedback; electric breakdown; equivalent circuits; radiofrequency amplifiers; semiconductor device reliability; MOSFET; RF amplifier designs; S-parameters; breakdown operation; equivalent circuit model; four-port measurement data; inductive behavior; inductive breakdown network; isolation reduction; metal-oxide-semiconductor field-effect transistors; modified four-port model; radiofrequency model; reliability; scattering parameters; series feedback mechanism; Electric breakdown; Impedance; Integrated circuit modeling; MOSFET; Radio frequency; Scattering parameters; Semiconductor device modeling; MOSFETs; avalanche breakdown; four-port; reliability;
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
DOI :
10.1109/TDMR.2015.2397447