Title :
Improved Modeling of Medium Voltage SiC MOSFET Within Wide Temperature Range
Author :
Kai Sun ; Hongfei Wu ; Juejing Lu ; Yan Xing ; Lipei Huang
Author_Institution :
Dept. of Electr. Eng., Tsinghua Univ., Beijing, China
Abstract :
An improved model of medium voltage (1200 V) silicon carbide (SiC) MOSFET based on PSpice is proposed in this paper, which is suitable for wide temperature range applications especially at low temperature. The static characteristics of SiC MOSFET are described by introducing temperature-dependent voltage source and current source. The effect of negative turn-off gate drive voltage is also taken into account in the modeling. In order to reflect the low-temperature characteristics of SiC MOSFET accurately, low temperature (-25 °C) measurements are carried out, which provide the modeling basis. The determinations of key parameters in the model are analyzed in detail, including the on-state resistor, internal gate resistor, temperature dependent sources, and some capacitors. The proposed model is verified by the experimental tests on a buck converter prototype at different input voltages, input currents, and temperatures. Simulation results on the proposed model coincide well with the experimental test results, in terms of switching waveforms and power losses even at low temperature (-25 °C). These results demonstrate that the proposed model exhibits high accuracy within wide temperature range.
Keywords :
MOSFET; SPICE; semiconductor device models; silicon compounds; wide band gap semiconductors; PSpice; SiC; buck converter prototype; internal gate resistor; medium voltage MOSFET; negative turn off gate drive voltage; on state resistor; power losses; static characteristics; switching waveforms; temperature -25 degC; temperature dependent current source; temperature dependent sources; temperature dependent voltage source; voltage 1200 V; wide temperature range; MOSFET; Semiconductor device modeling; Silicon carbide; Temperature dependence; Temperature distribution; Temperature measurement; MOSFET; Modeling; silicon carbide; temperature range;
Journal_Title :
Power Electronics, IEEE Transactions on
DOI :
10.1109/TPEL.2013.2273459