DocumentCode :
45887
Title :
Microelectromechanical Systems (MEMS) Resistive Heaters as Circuit Protection Devices
Author :
Coutu, Ronald A. ; Ostrow, Scott A.
Author_Institution :
Dept. of Electr. Eng., Air Force Inst. of Technol., Wright-Patterson AFB, OH, USA
Volume :
3
Issue :
12
fYear :
2013
fDate :
Dec. 2013
Firstpage :
2174
Lastpage :
2179
Abstract :
With increased opportunities for the exploitation (i.e., reverse engineering) of vulnerable electronic components and systems, circuit protection has become a critical issue. Circuit protection techniques are generally software-based and include cryptography (encryption/decryption), obfuscation of codes, and software guards. Examples of hardware-based circuit protection include protective coatings on integrated circuits, trusted foundries, and macro-sized components that self-destruct, thus destroying critical components. This paper is the first to investigate the use of microelectromechanical systems (MEMS) to provide hardware-based protection of critical electronic components to prevent reverse engineering or other exploitation attempts. Specifically, surface-micromachined polycrystalline silicon to be used as meandering resistive heaters were designed analytically and fabricated using a commercially available MEMS prototyping service (i.e., PolyMUMPs), and integrated with representative components potentially at risk for exploitation, in this case pseudomorphic high-electron mobility transistors (pHEMTs). The MEMS heaters were initiated to self-destruct, destroying a critical circuit component and thwart a reverse engineering attempt. Tests revealed reliable self-destruction of the MEMS heaters with approximately 25 V applied, resulting in either complete operational failure or severely altering the pHEMT device physics. The prevalent failure mechanism was metallurgical, in that the material on the surface of the device was changed, and the specific failure mode was the creation of a short-circuit. Another failure mode was degraded device operation due to permanently altered device physics related to either dopant diffusion or ohmic contact degradation. The results, in terms of the failure of a targeted electronic component, demonstrate the utility of using MEMS devices to protect critical components which are otherwise vulnerable to exploitation.
Keywords :
micromechanical devices; ohmic contacts; polymers; power HEMT; resistance heating; semiconductor doping; MEMS devices; MEMS heaters; MEMS prototyping service; MEMS resistive heaters; circuit protection devices; codes obfuscation; critical circuit component; critical electronic components; cryptography; decryption; device operation; dopant diffusion; encryption; failure mechanism; failure mode; hardware-based circuit protection; hardware-based protection; integrated circuits; macrosized components; microelectromechanical systems; ohmic contact degradation; operational failure; pHEMT device physics; protective coatings; pseudomorphic high-electron mobility transistors; reverse engineering; software guards; surface-micromachined polycrystalline silicon; trusted foundries; vulnerable electronic components; Intellectual property; Microelectromechanical systems; PHEMTs; Resistance; Reverse engineering; Thermal conductivity; Circuit protection; microelectromechanical systems (MEMS); resistive heaters; reverse engineering;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2013.2282362
Filename :
6626630
Link To Document :
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