Latest Progress in Power Modules for Appliance Inverter Applications

Author

Motto, E. ; Donlon, J. ; Shirakawa, Shinya ; Iwagami, Toru ; Kawafuji, Hisashi ; Seo, Mamoru ; Satou, Katsumi

Author_Institution

Powerex Inc., Youngwood, PA

Volume

3

fYear

2006

fDate

8-12 Oct. 2006

Firstpage

1222

Lastpage

1228

Abstract

This paper presents a new version of the dual in-line package intelligent power module (DIP-IPM Ver.4) developed by Mitsubishi Electric for home appliance motor control. The DIP-IPM Ver.4, features a completely lead free process with both chip bonding solders and lead plating compliant with international initiatives for the reduction of hazardous materials. Package miniaturization has been achieved by utilizing a new insulating resin sheet with high thermal conductivity, direct wire bonding technology, and an optimized lead frame design

Keywords

domestic appliances; invertors; lead bonding; machine control; packaging; DIP-IPM Ver.4; Mitsubishi Electric; chip bonding solders; direct wire bonding technology; dual in-line package intelligent power module; high thermal conductivity; home appliance motor control; insulating resin sheet; lead free process; lead plating compliant; package miniaturization; power modules; Bonding; Environmentally friendly manufacturing techniques; Hazardous materials; Home appliances; Inverters; Lead; Motor drives; Multichip modules; Packaging; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Industry Applications Conference, 2006. 41st IAS Annual Meeting. Conference Record of the 2006 IEEE

Conference_Location

Tampa, FL

ISSN

0197-2618

Print_ISBN

1-4244-0364-2

Electronic_ISBN

0197-2618

Type

conf

DOI

10.1109/IAS.2006.256687

Filename

4025374