Title :
Latest Progress in Power Modules for Appliance Inverter Applications
Author :
Motto, E. ; Donlon, J. ; Shirakawa, Shinya ; Iwagami, Toru ; Kawafuji, Hisashi ; Seo, Mamoru ; Satou, Katsumi
Author_Institution :
Powerex Inc., Youngwood, PA
Abstract :
This paper presents a new version of the dual in-line package intelligent power module (DIP-IPM Ver.4) developed by Mitsubishi Electric for home appliance motor control. The DIP-IPM Ver.4, features a completely lead free process with both chip bonding solders and lead plating compliant with international initiatives for the reduction of hazardous materials. Package miniaturization has been achieved by utilizing a new insulating resin sheet with high thermal conductivity, direct wire bonding technology, and an optimized lead frame design
Keywords :
domestic appliances; invertors; lead bonding; machine control; packaging; DIP-IPM Ver.4; Mitsubishi Electric; chip bonding solders; direct wire bonding technology; dual in-line package intelligent power module; high thermal conductivity; home appliance motor control; insulating resin sheet; lead free process; lead plating compliant; package miniaturization; power modules; Bonding; Environmentally friendly manufacturing techniques; Hazardous materials; Home appliances; Inverters; Lead; Motor drives; Multichip modules; Packaging; Thermal conductivity;
Conference_Titel :
Industry Applications Conference, 2006. 41st IAS Annual Meeting. Conference Record of the 2006 IEEE
Conference_Location :
Tampa, FL
Print_ISBN :
1-4244-0364-2
Electronic_ISBN :
0197-2618
DOI :
10.1109/IAS.2006.256687
