DocumentCode :
45994
Title :
Experimental and Theoretical Investigation of Pump Laser Induced Thermal Damage for Polycrystalline Ceramic and Crystal Nd:YAG
Author :
Yu Shen ; Yong Bo ; Nan Zong ; Ya-Ding Guo ; Qin-Jun Peng ; Jiang Li ; Yu-Bai Pan ; Jing-Yuan Zhang ; Da-Fu Cui ; Zu-Yan Xu
Author_Institution :
Key Lab. of Functional Crystal & Laser Technol., Univ. of Chinese Acad. of Sci., Beijing, China
Volume :
21
Issue :
1
fYear :
2015
fDate :
Jan.-Feb. 2015
Firstpage :
160
Lastpage :
167
Abstract :
Continuous wave 808-nm pump laser induced thermal damage of polycrystalline ceramic and crystalline Nd:YAG materials were investigated both experimentally and theoretically in this paper. The measured temperature agrees well with the theoretical simulation and the maximum hoop stress occurs on the incident facet of the end pumped rod at about √2 times of the pump beam radius w0, where the temperature gradient is the highest and the damage occurs first. The pumping laser power makes no influence on the maximum hoop stress location, when the position of the laser beam is unchanged. The thermal damage investigation indicates that the transparent ceramic Nd:YAG has greater resistance than thermal fracture and it is 64% higher than that of the crystals.
Keywords :
ceramics; laser beam effects; neodymium; optical materials; optical pumping; thermal conductivity; thermal stresses; yttrium compounds; YAG:Nd; continuous wave pump laser induced thermal damage; crystalline materials; end pumped rod; hoop stress location; laser beam position; polycrystalline ceramics; pump beam radius; pumping laser power; temperature gradient; thermal fracture; thermal resistance; transparent ceramics; wavelength 808 nm; Ceramics; Crystals; Laser beams; Laser excitation; Measurement by laser beam; Pump lasers; Temperature measurement; Ceramics; crystal; solid lasers; thermal resistance; thermal stress;
fLanguage :
English
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
1077-260X
Type :
jour
DOI :
10.1109/JSTQE.2014.2351791
Filename :
6883161
Link To Document :
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