DocumentCode :
460136
Title :
Superlattice Material for the Multi-Junction Thermophotovoltaics Lattice Matched to InP
Author :
Bhusal, L. ; Freundlich, A.
Author_Institution :
Dept. of Phys., Houston Univ., TX
Volume :
1
fYear :
2006
fDate :
38838
Firstpage :
683
Lastpage :
685
Abstract :
Power conversion in a thermophotovoltaic (TPV) or any other photovoltaic device can be increased by implementing monolithically series connected multibandgap structure in the device. The main concern for the multi-band gap device is the availability of different band gaps for the optimal operation of the device. Based on the recent work, GaAsN/InAsN superlattice lattice matched to InP has shown the potential of achieving band gaps in the range of 0.7-0.35eV, which is technologically important range for the TPV structure due to the availability of the photon energies in this range from the heat source. Integration of such a strain balanced superlattice structures in the conventional 0.74eV InGaAs p-i-n junction diode to produce multi-bandgap monolithically series connected devices is discussed. It is shown that these devices could surpass the performance of the bulk-like lattice mismatched InGaAs TPV converters, enabling the multi-junction tandem cell on InP
Keywords :
III-V semiconductors; energy gap; gallium arsenide; gallium compounds; indium compounds; p-i-n diodes; semiconductor superlattices; thermophotovoltaic cells; GaAsN-InAsN; InGaAs; InP; TPV; band gaps; heat source; lattice mismatched TPV converters; monolithically series connected multibandgap structure; multijunction tandem cell; multijunction thermophotovoltaics; p-i-n junction diode; photon energies; photovoltaic device; power conversion; strain balanced superlattice material; Availability; Capacitive sensors; Indium gallium arsenide; Indium phosphide; Lattices; Photonic band gap; Photovoltaic systems; Power conversion; Solar power generation; Superlattices;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location :
Waikoloa, HI
Print_ISBN :
1-4244-0017-1
Electronic_ISBN :
1-4244-0017-1
Type :
conf
DOI :
10.1109/WCPEC.2006.279547
Filename :
4059720
Link To Document :
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