• DocumentCode
    460182
  • Title

    High-Quality Surface Passivation Obtained by High-Rate Deposited Silicon Nitride, Silicon Dioxide and Amorphous Silicon using the Versatile Expanding Thermal Plasma Technique

  • Author

    Hoex, B. ; Peeters, F.J.J. ; van Erven, A.J.M. ; Bijker, M.D. ; Kessels, W.M.M. ; van de Sanden, Mauritius C. M.

  • Author_Institution
    Dept. of Appl. Phys., Eindhoven Univ. of Technol.
  • Volume
    1
  • fYear
    2006
  • fDate
    38838
  • Firstpage
    1036
  • Lastpage
    1039
  • Abstract
    The expanding thermal plasma (ETP) is a novel plasma technique currently used by several solar cell manufacturers for the deposition of silicon nitride antireflection coatings on (multi-) crystalline silicon solar cells. In this paper we will show that the ETP technique is versatile and can be used for the deposition of silicon nitride, silicon dioxide and hydrogenated amorphous silicon with a good level of surface passivation. In this way the ETP technique can meet the future PV demands with respect to the decrease in wafer thickness and the use of n-type material that requires good electrical and optical quality thin films at both the front and the back side of the solar cell
  • Keywords
    amorphous semiconductors; antireflection coatings; elemental semiconductors; passivation; plasma materials processing; silicon; silicon compounds; solar cells; ETP technique; Si; SiN; SiO2; antireflection coatings; electrical properties; expanding thermal plasma; hydrogenated amorphous silicon; multicrystalline silicon solar cells; n-type material; optical properties; silicon dioxide; silicon nitride; solar cell manufacturers; surface passivation; thermal plasma technique; thin films; Amorphous silicon; Coatings; Crystallization; Manufacturing; Optical films; Passivation; Photovoltaic cells; Plasma materials processing; Silicon compounds; Thermal expansion;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
  • Conference_Location
    Waikoloa, HI
  • Print_ISBN
    1-4244-0017-1
  • Electronic_ISBN
    1-4244-0017-1
  • Type

    conf

  • DOI
    10.1109/WCPEC.2006.279296
  • Filename
    4059808