DocumentCode
460182
Title
High-Quality Surface Passivation Obtained by High-Rate Deposited Silicon Nitride, Silicon Dioxide and Amorphous Silicon using the Versatile Expanding Thermal Plasma Technique
Author
Hoex, B. ; Peeters, F.J.J. ; van Erven, A.J.M. ; Bijker, M.D. ; Kessels, W.M.M. ; van de Sanden, Mauritius C. M.
Author_Institution
Dept. of Appl. Phys., Eindhoven Univ. of Technol.
Volume
1
fYear
2006
fDate
38838
Firstpage
1036
Lastpage
1039
Abstract
The expanding thermal plasma (ETP) is a novel plasma technique currently used by several solar cell manufacturers for the deposition of silicon nitride antireflection coatings on (multi-) crystalline silicon solar cells. In this paper we will show that the ETP technique is versatile and can be used for the deposition of silicon nitride, silicon dioxide and hydrogenated amorphous silicon with a good level of surface passivation. In this way the ETP technique can meet the future PV demands with respect to the decrease in wafer thickness and the use of n-type material that requires good electrical and optical quality thin films at both the front and the back side of the solar cell
Keywords
amorphous semiconductors; antireflection coatings; elemental semiconductors; passivation; plasma materials processing; silicon; silicon compounds; solar cells; ETP technique; Si; SiN; SiO2; antireflection coatings; electrical properties; expanding thermal plasma; hydrogenated amorphous silicon; multicrystalline silicon solar cells; n-type material; optical properties; silicon dioxide; silicon nitride; solar cell manufacturers; surface passivation; thermal plasma technique; thin films; Amorphous silicon; Coatings; Crystallization; Manufacturing; Optical films; Passivation; Photovoltaic cells; Plasma materials processing; Silicon compounds; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Energy Conversion, Conference Record of the 2006 IEEE 4th World Conference on
Conference_Location
Waikoloa, HI
Print_ISBN
1-4244-0017-1
Electronic_ISBN
1-4244-0017-1
Type
conf
DOI
10.1109/WCPEC.2006.279296
Filename
4059808
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